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Clay-Bond PLUS

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Clay-Bond™ PLUS joins silver, bronze, copper and brass!

Put away the torch and solder! Clay-Bond is the easy way to join metal clay pieces. Clay-Bond is a silver containing powder that easily turns into a paste when mixed with water. Whether your pieces have been formed from metal clay or stamped sheet, simply apply the product with a short/stiff bristled brush and fire embedded in activated carbon. After firing it forms a strong metallic joint suitable for all jewelry-related applications.

Clay-Bond Plus™ replaces original Clay-Bond™. The original formula of Clay-Bond™ was a silver solder introduced in 2010 to join jewelry articles made from BRONZclay™, COPPRclay™, and brass, but it was not recommended for use with silver clay articles. Clay-Bond Plus™ is formulated (with the same silver content) to join fired silver clay – both PMC and Art Clay – sterling silver, fine silver, Argentium™, BRONZclay™, COPPRclay™, and brass in any combination. It is a water-base paste containing a binder that cements the two surfaces to be joined in position until heat is applied, thus eliminating the need to manually position the pieces. It is applied to the join region, dried, and fired in activated carbon in a kiln to create a strong bond. It can also be torch fired in air. Clay-Bond Plus™ is available in 5 gram and 10 gram packages. A little goes a long way! CLICK HERE FOR INSTRUCTIONS

Item# Item Name Our Price Qty Add
54678-5 Clay-Bond - PLUS 5gm
54678-10 Clay-Bond PLUS - 10gm
Check the items you wish to purchase, then click

Additional Information:

Instructions describe how to use Clay-Bond to join two flat surfaces, as well as how to join exposed joints such as in jump rings.


CLICK HERE FOR "Clay-Bond PLUS: An Alternative to Solder" by Jennifer Gastelum

Holly Ginsberg Gage asked via Facebook:
Is this joint stronger than metal clay and pastemaker or lavendar?

A paste made of the metal using PasteMaker will indeed bond like metal clays together and facilitate repairs. However, there are advantages of Clay-Bond Plus that a paste as above cannot do.

This from the producer, Ron Diegel:

"CB+ offers quick firing (15 min) at a relatively low temperature (350C), which makes for convenience in forming joins quickly. It does not require the higher firing temperature of various metal clays."

"It is easy to avoid fire scale formation when using it on sterling silver because of the lower soldering temperature of 350C."

Further, ClayBond can join two different metals together such as sterling to bronze, copper to fine silver - any combination really. Also, Clay-Bond Plus acts like a glue, keeping two pieces together after it dries making handling the piece less delicate for the firing process.

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